宁圃奇

  • 宁圃奇
  • 学术方向:
    1)宽禁带半导体前沿探索; 2)功率模块封装新技术; 3)高功率密度变频器
    简历:
    2004年毕业于清华大学电机系获工学学士,2006年毕业于清华大学电机系获工学硕士学位,2010年获美国弗吉尼亚理工大学电气与计算机工程系工学博士学位。2010-2013年在美国橡树岭国家实验室从事功率模块封装与高功率密度变频器等方面的研究工作。2013年加入中国科学院电工研究所,2014入选中组部“青年千人计划”。
    代表论著:

    [1]P. Ning, F. Wang, and K. D. T. Ngo, "Forced-Air Cooling System Design Under Weight Constraint for High-Temperature SiC Converter," IEEE Trans. on Power Electronics, Vol.29,issue 4, pp.1998-2007, April,2014

    [2]P. Ning, Di Zhang, Rixin Lai, Dong Jiang, Fred Wang, Dushan Boroyevich, Rolando Burgos, Kamiar Karimi, Vikram Immanue, and Eugene Solodovnik, " Development of a 10 kW High Temperature, High Power Density Three-Phase AC-DC-AC SiC Converter," IEEE Industrial Electronics Magazine, Vol. 7, issue 1,pp. 6-17, March, 2013

    [3]P. Ning, F. Wang, and K. Ngo, "Automatic Layout Design for Power Module," IEEE Trans. on Power Electronic, Vol. 28, issue 1, pp. 481-487, Jan, 2013.

     [4]P. Ning, F. Wang, and K. Ngo, "High Temperature SiC Power Module Electrical Evaluation Procedure," IEEE Trans. on Power Electronics, Vol. 26, issue 11, pp. 3079-3083, Nov, 2011.

     [5]P. Ning, G. Lei, F. Wang, G. Lu, K. Ngo, and K. Rajashekara, "A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module", IEEE Trans. on Power Electronics, Vol.25, issue 8, pp. 2059 – 2067, Aug, 2010.

    [6]P. Ning, R. Lai, D. Huff, F. Wang, K. Ngo, K. Karimi, and V. Immanuel, "SiC Wirebond Multi-Chip Phase-Leg Module Packaging Design and Testing for Harsh Environment," IEEE Trans. on Power Electronics, Vol. 25, issue 1, pp. 16-23, Jan, 2010.